A chiplet^[1][2][3][4] is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package to create a complex component such as a computer processor. Each chiplet in a computer processor provides only a portion of the processor's functionality. A set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This provides several advantages over a traditional system on chip (SoC) which is monolithic as it comprises a single silicon die:

• Reusable IP (intellectual property):^[5] the same chiplet can be used in many different devices
• Heterogeneous integration:^[6] chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function
• Known good die:^[7] chiplets can be tested before assembly, improving the yield of the final device.

Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or an advanced package.

Chiplets may be connected with standards such as UCIe, bunch of wires (BoW), AIB, OpenHBI, and OIF XSR.^[8][9] Chiplets not designed by the same company must be designed with interoperability in mind, a daunting task.^[10]

The term was coined by University of California, Berkeley professor John Wawrzynek as a component of the RAMP Project (research accelerator for multiple processors) in 2006 ^[11][12] extension for the Department of Energy.

Common examples include:

• Intel Meteor Lake
• AMD Ryzen based on Zen 2 and later architecture
• NVidia H100

• Multi-chip module

• Clark, Don (11 May 2023). "U.S. Focuses on Invigorating 'Chiplets' to Stay Cutting-Edge in Tech". The New York Times.